Tel Aviv University Center for Nanotechnology

Tel Aviv University Center for Nanotechnology Center for Nanoscience and Nanotechnology
Research Facility
Nanodevice Fabrication, Characterization, Imaging and Analysis
šŸ“Tel - Aviv University, Israel

Tel Aviv University founded Israel's first nano center, and has built a truely comprehensive, multidisciplinary and collaborative nano research base that has proven scientific results and applications.

10/05/2026

Wet benches are essential to precision nanofabrication workflows, enabling chemical processing stages such as RCA cleaning, HF-based oxide etching, polymer stripping, and metal lift-off. At the TAU Nano Centerā€™s industrial-grade cleanroom, the wet stations operate under Class 100 conditions, using ultra-pure water (18.2 MĪ©Ā·cm), advanced exhaust and scrubber systems, and laminar flow environments. Designed for 4" to 8" wafers, these benches support manual and semi-automated chemical processes, offering flexibility for both academic research and industry prototyping. Integrated with Sub-Fab exhaust treatment, they form a safe, high-performance platform for microelectronics, MEMS, and nanophotonics development. Keywords: nanotechnology, wet bench, cleanroom, chemical etching, HF, RCA cleaning, UPW, semiconductor fabrication, TAU, nanofabrication infrastructure.

The VERSALINEā„¢ļø LLH-DSE-III has arrived at the Tel Aviv University Nano Center, redefining deep reactive ion etching (DR...
07/05/2026

The VERSALINEā„¢ļø LLH-DSE-III has arrived at the Tel Aviv University Nano Center, redefining deep reactive ion etching (DRIE) precision.
With advanced plasma control and industrial-grade 200 mm wafer compatibility, it opens new frontiers in 3D integration, MEMS, and advanced packaging.
Installed within Israelā€™s largest academic cleanroom, this system strengthens the TAU.nano ecosystem and accelerates innovation across nanotechnology, semiconductors, and photonics.

The Disco DAG810 Surface Grinder at the TAU Nano Center enables precision wafer thinning and surface planarization essen...
05/05/2026

The Disco DAG810 Surface Grinder at the TAU Nano Center enables precision wafer thinning and surface planarization essential for advanced semiconductor packaging and 3D integration. This semi-automatic system grinds silicon wafers up to 200 mm in diameter with sub-10 nm surface roughness, preparing ultra-thin, flat substrates for Through-Silicon Vias (TSVs) and System-in-Package (SiP) assemblies. Operating within the cleanroom environment, the DAG810 supports researchers and industry partners in fabricating next-generation nanoelectronic with exceptional dimensional control. Follow for more nanotechnology content.

03/05/2026

The Sub-Fab at the TAU Nano Center is the critical support infrastructure beneath the cleanroom, housing high-performance systems that enable precision nanofabrication. From vacuum pumps and toxic gas abatement to chillers, UPW systems, and specialty gas delivery, the Sub-Fab operates 24/7 to maintain stability, cleanliness, and safety. This behind-the-scenes facility ensures uninterrupted operation of advanced nanotechnology tools used in semiconductor fabrication, MEMS, photonics, and quantum materials research. Discover the technological backbone of TAU's cleanroom and the complexities of operating a state-of-the-art Sub-Fab system.

30/04/2026

The Thermo Fisher Spectra 200 S/TEM at the TAU Nano Center provides sub-angstrom resolution imaging and real-time chemical mapping capabilities (EDS, EELS). Combining scanning and transmission modes, it enables researchers to analyze crystal structures, defects, interfaces, and thin films with exceptional accuracy. The systemā€™s advanced field-emission source, stable optics, and high-sensitivity detectors make it an essential tool for nanotechnology, semiconductor development, and quantum materials research. Integrated into the centerā€™s full fabricationā€“characterization workflow, the Spectra 200 supports both academic and industrial R&D at the highest standard.

3D chip integration marks a paradigm shift in semiconductor design. By stacking chips vertically and connecting them thr...
23/04/2026

3D chip integration marks a paradigm shift in semiconductor design. By stacking chips vertically and connecting them through nanoscale vias, this technology delivers faster, more efficient, and compact devices - from AI processors to biomedical sensors. At the Tel Aviv University Nano Center (TAU.nano), researchers and industry partners are pioneering advanced 3D packaging with cutting-edge tools like deep RIE systems and wafer grinders, enabling local end-to-end fabrication for the first time in Israel.

.nano

As part of the ongoing transition to the new Roman Abramovich Building, two distinct and complementary nanofabrication s...
19/04/2026

As part of the ongoing transition to the new Roman Abramovich Building, two distinct and complementary nanofabrication systems have been successfully relocated from the previous facility and are now fully operational in the new cleanroom at the TAU Nano Center. This milestone reflects continued progress in the multi-stage migration of advanced research infrastructure.

The RAITH E-Beam Lithography enables direct-write patterning with sub-10 nm precision, making it a critical tool for fabricating nanoscale structures used in semiconductors, quantum devices, photonics, and advanced sensors. Its strength lies in ultra-high-resolution lithography, allowing researchers to design and define complex nanostructures with exceptional accuracy.

Alongside it, the Focused Ion Beam (FIB) provides a complementary capability: precise material modification at the nanoscale. The FIB enables site-specific milling, cross-sectioning, prototyping, and sample preparation - essential for device optimization, failure analysis, and high-resolution structural investigation.

Together, these two systems form a powerful nanotechnology workflow, bridging fabrication and modification within a cleanroom environment. Their successful relocation marks another step in the broader process, underway for several months, steadily advancing toward the full transition of all nanofabrication and characterization tools into the new facility. This unified infrastructure will support cutting-edge research in nanotechnology, nanomedicine, semiconductors, and beyond at TAU.

Femtosecond laser processing - where each pulse lasts just 10ā»Ā¹āµ seconds - enables ā€œcoldā€ precision machining at the mic...
16/04/2026

Femtosecond laser processing - where each pulse lasts just 10ā»Ā¹āµ seconds - enables ā€œcoldā€ precision machining at the micro and nano-scale.
At the Tel Aviv University Nano Center, the ELAS system supports cutting-edge research in photonics, semiconductors, and nano-bio technologies.
This capability empowers scientists and industries to fabricate 3D microstructures, waveguides, and integrated optical devices with sub-micron precision and nanoscale control.

14/04/2026

The High-Resolution Scanning Electron Microscope (HR-SEM) at the TAU Nano Center, the FEI Apreo, enables nanoscale imaging with sub-nanometer resolution and advanced analytical capabilities. Equipped with state-of-the-art detectors including secondary electrons (SE), backscattered electrons (BSE), and cathodoluminescence (CL), it allows researchers to explore not only surface topography but also optical and compositional properties of nanostructures. The system supports low-voltage imaging, ideal for delicate or soft materials, and facilitates advanced research in nanophotonics, 2D materials, nanomedicine, semiconductors, and surface engineering. As part of the integrated fabrication and characterization workflow at TAU's cleanroom, this HR-SEM is a cornerstone for cutting-edge nanotechnology research and development.

14/04/2026

The High-Resolution Scanning Electron Microscope (HR-SEM) at the TAU Nano Center, the FEI Apreo, enables nanoscale imaging with sub-nanometer resolution and advanced analytical capabilities. Equipped with state-of-the-art detectors including secondary electrons (SE), backscattered electrons (BSE), and cathodoluminescence (CL), it allows researchers to explore not only surface topography but also optical and compositional properties of nanostructures. The system supports low-voltage imaging, ideal for delicate or soft materials, and facilitates advanced research in nanophotonics, 2D materials, nanomedicine, semiconductors, and surface engineering. As part of the integrated fabrication and characterization workflow at TAUā€™s cleanroom, this HR-SEM is a cornerstone for cutting-edge nanotechnology research and development.

Nanofabrication TAUNano

The VST tool multifunctional PVD cluster system is one of the most advanced thin-film deposition tools at the TAU Center...
12/04/2026

The VST tool multifunctional PVD cluster system is one of the most advanced thin-film deposition tools at the TAU Center for Nanoscience and Nanotechnology. Designed for both electron-beam evaporation and magnetron sputtering within a unified ultra-high-vacuum chamber, the VST tool enables precise, automated fabrication of ultra-thin films on semiconductor wafers up to 200 mm in diameter. Equipped with multiple sputtering targets for co-deposition of complex material stacks, cryogenic pumping for superior vacuum quality, and robotic wafer handling, this system supports the production of metallic, dielectric, and hybrid nanolayers essential for microelectronics, sensors, and photonic devices.
By combining industrial-grade automation with research-level flexibility, the VST tool empowers TAU.nano researchers to explore next-generation nanoelectronics, quantum materials, and 3D integration technologies - pushing the frontiers of nanoscale fabrication in Israel.
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