09/03/2026
Boise State University has been charged with spearheading Idaho's launch into developing resilient microelectronics that are usable in extreme environments. As part of this initiative, the 'XTREME' project was formed under a new 8 million dollar grant funded by the National Science Foundation to investigate how microelectronic materials behave under extremely high temperature, radiation, and stress.
Recently, MSMSE Faculty Dave Estrada, a principal investigator for XTREME spoke on Boise State news regarding the project, its goals, and the research involved.
Take a look in our bio for a link to the full article.